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Microelectromechanical systems
Results: 938

#	Item
211	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-13 17:05:57 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
212	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2013-01-18 04:01:57 Technology Electronics manufacturing Chemical bonding Wafer bonding Microelectromechanical systems Deep reactive-ion etching Wafer Through-silicon via EV Group Semiconductor device fabrication Materials science Microtechnology
213	ews 3D micro/nano-polymerised black silicon and Image of the Year Researchers at MCN have pioneered an approach that produces intricate structures with micro/nano-polymerisation using the highly refractive long thin nano Add to Reading List Source URL: nanomelbourne.com Language: English - Date: 2013-04-11 20:48:14 Physics Focused ion beam Scanning electron microscope Melbourne Centre for Nanofabrication Thin film Electron microscope Corrosion Microelectromechanical systems Laser Science Scientific method Electron microscopy
214	IEEE ELECTRON DEVICE LETTERS, VOL. 35, NO. 5, MAY[removed]Nanometer-Scale Vertical-Sidewall Reactive Ion Etching of InGaAs for 3-D III-V MOSFETs Add to Reading List Source URL: www-mtl.mit.edu Language: English - Date: 2014-05-20 14:14:37 Technology Microtechnology Etching Microelectromechanical systems Reactive-ion etching Nanowire Indium gallium arsenide MOSFET Dry etching Semiconductor device fabrication Materials science Chemistry
215	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM 3D S YS TEM INTEGRATION TS V INTERPOS ER Silicon interposers with through silicon vias (TSVs) are an important element for the realization of 3D system-in-pa Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-11 11:27:45 Materials science Wafer Three-dimensional integrated circuit Microelectromechanical systems Through-silicon via Flip chip Fraunhofer Society Die preparation Semiconductor device fabrication Microtechnology Electronics
216	CSIRO_Grad_CMYK_withxheight Add to Reading List Source URL: nanomelbourne.com Language: English - Date: 2013-10-08 21:36:52 Electrical engineering Semiconductor device fabrication Thin film deposition Nanotechnology Melbourne Centre for Nanofabrication SPIE Microelectromechanical systems Nanolithography Lab-on-a-chip Materials science Technology Microtechnology
217	ews VICTORIAN NODE Industry looks to partner with MCN in R&D MCN has become a regular feature of the Small Technologies Industry Uptake Program (STIUP), Add to Reading List Source URL: www.nanomelbourne.com Language: English - Date: 2012-07-01 19:17:06 Microtechnology Science Biotechnology Electrical engineering Microelectromechanical systems Nanotechnology Lithography Nanolithography Biosensor Technology Materials science Melbourne Centre for Nanofabrication
218	Biography of Professor N.R. Aluru Speaker: Prof N R Aluru is Richard W Kritzer Professor of the Department of Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, University of Illin Add to Reading List Source URL: engg.hku.hk Language: English - Date: 2010-09-27 03:17:45 Electromagnetism Electrical engineering Mechanical engineering Technology Nanoelectromechanical system Microelectromechanical systems NEMS Micro-opto-mechanical systems Materials science Microtechnology Nanoelectronics
219 $Mechanics / Semiconductor device fabrication / Glass physics / Fracture / Microelectromechanical systems / Bone fracture / Deep reactive-ion etching / Materials science / Physics / Microtechnology$	FractureGate: Fracture Fabrication of Single Crystal Silicon Nanosurfaces Alexander D. Sprunt & Alexander H. Slocum MIT Mechanical Engineering – Precision Engineering Research Group Room 3-470, 77 Massachusetts Avenue, Add to Reading List Source URL: cba.mit.edu Language: English - Date: 2011-12-13 18:50:17 Mechanics Semiconductor device fabrication Glass physics Fracture Microelectromechanical systems Bone fracture Deep reactive-ion etching Materials science Physics Microtechnology
220	Australian Earthquake Engineering Society 2009 Conference Low Cost Accelerometer Sensors - Applications and Challenges Nicholas Haritos Reader, Department of Civil & Environmental Engineering, The University of Add to Reading List Source URL: www.aees.org.au Language: English - Date: 2013-11-30 06:43:33 Transducers Microtechnology Measuring instruments Microelectromechanical systems Wireless sensor network Structural health monitoring Data logger MotionProcessing Piezoelectric accelerometer Technology Engineering Accelerometers

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